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| MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 Features Ultra Broad Bandwidth: 50MHz to 26GHz 0.9 Insertion Loss , 34dB Isolation at 20GHz 50nS Switching Speed Fully Monolithic, Glass Encapsulated Chip with Polymer Protective Coating Description The MA4SW410 is a SP4T series-shunt broad band switch made with M/A-COM's unique HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in a low loss, low dispersion glass. This hybrid combination of silicon and glass gives HMIC switches exceptional low loss and remarkable high isolation through low millimeter-wave frequencies. Yellow areas indicate bond pads Applications These high performance switches are suitable for use in multi-band ECM, radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5V/-5V, TTL controlled PIN diode driver, 50nS switching speeds are achieved. J3 J4 Absolute Maximum Ratings TAMB = +25C ( Unless Otherwise Specified ) Parameter Operating Temperature Storage Temperature RF C.W. Incident Power Forward Bias Current Reverse Applied Voltage Value -65C to +125C -65C to +150C +30dBm 20mA -25 Volts J2 J5 J1 Notes: 1. Exceeding any one of these values may result in permanent damage to the chip. 2. Maximum operating conditions for combination of RF power, D.C. bias and temperature: +30dBm C.W. @ 15mA/diode @ +85C 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 Typical Driver Connections Condition of RF Output J1 - J2 Low Loss Isolation Isolation Isolation Condition of RF Output J1 - J3 Isolation Low Loss Isolation Isolation Condition of RF Output J1 - J4 Isolation Isolation Low Loss Isolation Condition of RF Output J1 - J5 Isolation Isolation Isolation Low Loss Control Level ( DC Current ) at Port J2 -20mA +20mA +20mA +20mA J3 +20mA -20mA +20mA +20mA J4 +20mA +20mA -20mA +20mA J5 +20mA +20mA +20mA -20mA Electrical Specifications @ TAMB = +25oC, 20mA Bias Current (On-Wafer Measurements) Parameter Insertion Loss Isolation Input Return Loss Output Return Loss Switching Speed 1 Frequency 20 GHz 20 GHz 20 GHz 20 GHz 10 GHz Minimum 28 Nominal 0.9 34 15 15 50 Maximum 1.3 Units dB dB dB dB nS Note: 1. Typical switching speed is measured from 10% to 90% of detected RF voltage driven by a TTL compatible driver. Driver output parallel RC network uses a capacitor between 390pF - 560pF and a resistor between 150 - 220 to achieve 50nS rise and fall times. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 Operation of the MA4SW410 PIN Switch Operation of the MA4SW410 PIN switch is achieved by the simultaneous application of negative DC current to the low loss port and positive DC current to the remaining isolated switching ports as shown in Figure 1. The backside area of the die is the RF and DC return ground plane. The DC return is achieved on the common port, J1. The DC control currents should be supplied by constant current source. The voltages at these points will not exceed 1.5 volts (1.2 volts typical) for supply currents up to 20mA. In the low loss state, the series diode must be forward biased and the shunt diode reverse biased. For all the isolated ports, the shunt diode is forward biased and the series diode is reverse biased. The bias network design should yield > 30dB RF to DC isolation. Best insertion loss, P1dB, IP3, and switching speed are achieved by using a voltage pull-up resistor in the DC return path, J1. A minimum value of |-2V| is recommended at this return node, which is achievable with a standard, 5V TTL controlled PIN driver. A typical DC bias schematic for 2-18 GHz operation is shown in Fig.1. 2 - 18 GHz Bias Network Schematic J1 39 pF 22 pF DC Bias 22nH 39 pF 100 22nH J5 MA4SW410 Die 22 pF J2 J4 Fig. 1 3 J3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 Typical Microwave Performance MA4SW410 INSERTION LOSS 0.0 Loss (dB) -0.5 -1.0 -1.5 -2.0 0.0 5.0 10.0 15.0 Frequency (GHz) 20.0 25.0 30.0 J1-J2 J1-J3 J1-J4 J1-J5 MA4SW410 INPUT RETURN LOSS 0 -10 Loss (dB) -20 J1-J2 -30 -40 -50 -60 0 5 10 15 20 25 30 J1-J3 J1-J4 J1-J5 Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 Typical Microwave Performance MA4SW410 OUTPUT RETURN LOSS 0 -5 -10 Loss (dB) -15 -20 -25 -30 -35 0 5 10 15 Frequency (GHz) 20 25 30 J2 J3 J4 J5 MA4SW410 ISOLATION 0 -10 -20 Isolation (dB) -30 -40 -50 -60 -70 -80 -90 0 5 10 15 Frequency (GHz) 20 25 30 J1-J2 J1-J3 J1-J4 J1-J5 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 ASSEMBLY INSTRUCTIONS Cleanliness These chips should be handled in a clean environment free of organic contamination. Electro-Static Sensitivity The MA4SW410 PIN diode switch is ESD, Class 1A sensitive (HBM). The proper ESD handling procedures must be used. Wire Bonding Thermosonic wedge bonding using 0.003" x 0.00025" ribbon or 0.001" diameter gold wire is recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. If ultrasonic energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires should be kept as short as possible. Chip Mounting The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the temperature at the chip should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders rich in tin should not be used. Epoxy Die Attachment: A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product instructions. Typically 150C for 1 hour. 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW410 HMICTM Silicon SP4T PIN Diode Switch RoHS Compliant Rev. V3 MA4SW410 Chip Dimensions DIM A B C D E F G H I J Thickness INCHES NOMINAL .066 .047 .054 .012 .043 .009 .004 .004 .033 .061 .005 .005X.005 MM NOMINAL 1.67 1.19 1.37 0.31 1.08 0.22 0.11 0.11 0.84 1.56 .120 0.120X.0120 Notes: 1.Topside and backside metallization is gold , 2.5m thick typical. 2.Yellow areas indicate bonding pads Bond Pads *All chip dimension tolerances are .0005" 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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